MEM-GATE

Your Gateway to Academic and Professional Success

The MEM-GATE programme, funded by the DAAD, offers master students in Electrical and Microsystems Engineering (MEM) the incredible opportunity to enhance their academic and professional journey.

Through successful participation, students can:

  • Improve their German language skills by attending German language courses during semester breaks
  • Develop intercultural competence by participatin in workshops on intercultural sensitivity
  • Get valualbe advice on how to organize their studies in workshops about study orgnization and learning strategies 
  • Take part in company excursions and factory tours in order to
    • gain valuable insights into the regional job market 
    • connect with local businesses and
    • explore career opportunities

Participants receive a confirmation of participation.

This offer is provided for you free of charge.

 

Upcoming Events

  • Study Organisation Workshop: 16 March 2026, 4:00–7:00 p.m.
  • Kick-Off Event: 31 March 2026, starting 5:00 p.m.
  • Intercultural Training (2-Day Workshop): 5 May 2026, 2:00–8:00 p.m. AND 8 May 2026, 2:00 p.m. to 8:00 p.m.
  • Company Excursion: to be announced
  • German Language Courses A2.1 & B1.1: September 2026

For questions or further information, feel free to contact Mrs. Lina Krug at mastermem(at)oth-regensburg.de.

Join the MEM GATE programme!

  • To qualify for MEM-GATE, applicants must meet the following criteria:

    • A strong academic record from prior studies,
    • Outstanding motivation, and
    • Enrolment in the Master degree programme in Electrical and Microsystems Engineering at OTH Regensburg.

  • Interested in joining MEM-GATE? Here’s how to apply:

    Please send your application documents to mastermem(at)oth-regensburg.de before the application deadline.

    The required docuemnts are: 

    • VPD
    • letter of motivation (max. 1 page, answering the question: Why are you the ideal candidate for MEM-GATE?)
    • CV

    Application deadline is 25 March 2026.


Current Application Deadline: March 25, 2026